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Paid glass substrate inspection device Product List

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TGV Through Hole Glass Substrate Inspection Device

The optimal imaging inspection device for TGV inspection has been completed!

By using high-resolution 2D and 3D cameras, and combining them with NIR (near-infrared), we have achieved the detection of all types of defects. In addition to conventional high-precision surface inspection, it is now possible to measure internal defects and depth using NIR. Furthermore, the range of compatible materials has expanded beyond just glass to include SiC/silicon wafers, ABF films, and more. Please feel free to contact us.

  • Printed Circuit Board
  • Semiconductor inspection/test equipment
  • Visual Inspection Equipment
  • Paid glass substrate inspection device

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